Mainboard Model ML10Gen9 (0x0000024D - 0x00B8B68E)
Intel RAID-5, 使用 480 GB SSD (SATA), RAID用3顆(?), 1顆當備材(?)
OS: windows 2016
Software
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Windows Version Microsoft Windows Server (10.0) Server Standard (x64), Build 14393.8330
Windows Installation Date 11/6/2021
DirectX Version 12.0
CPU資料
BIOS 資料(可更新)Processors Information
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Socket 1 ID = 0
Number of cores 4 (max 4)
Number of threads 4 (max 4)
Manufacturer GenuineIntel
Name Intel Xeon E3 1225
Codename Skylake
Specification Intel(R) Xeon(R) CPU E3-1225 v5 @ 3.30GHz
Package (platform ID) Socket 1151 LGA (0x1)
CPUID 6.E.3
Extended CPUID 6.5E
Core Stepping R0
Technology 14 nm
TDP Limit 80.0 Watts
Tjmax 100.0 蚓
Core Speed 1596.1 MHz
Multiplier x Bus Speed 16.0 x 99.8 MHz
Base frequency (cores) 99.8 MHz
Stock frequency 3300 MHz
Max frequency 3700 MHz
Instructions sets MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES, AVX, AVX2, FMA3, TSX
Microcode Revision 0xD6
L1 Data cache 4 x 32 KB (8-way, 64-byte line)
L1 Instruction cache 4 x 32 KB (8-way, 64-byte line)
L2 cache 4 x 256 KB (4-way, 64-byte line)
L3 cache 8 MB (16-way, 64-byte line)
Max CPUID level 00000016h
Max CPUID ext. level 80000008h
FID/VID Control yes
Turbo Mode supported, enabled
Max non-turbo ratio 33x
Max turbo ratio 37x
Max efficiency ratio 8x
Min operating ratio 8x
O/C bins none
Power Max (PL1) 80.00 W
PL1 Time Window 28.00 s
Short Power Max (PL2) 100.00 W
Current Max (IccMax) 100.00 A
Ratio 1 core 37x
Ratio 2 cores 36x
Ratio 3 cores 35x
Ratio 4 cores 34x
IA Voltage Mode PCU adaptive
IA Voltage Offset 0 mV
GT Voltage Mode PCU adaptive
GT Voltage Offset 0 mV
LLC/Ring Voltage Mode PCU adaptive
LLC/Ring Voltage Offset 0 mV
Agent Voltage Mode PCU adaptive
Agent Voltage Offset 0 mV
TDP Level 80.0 W @ 33x
...
Chipset (原為32GB更新為64GB)BIOS
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UEFI Yes
BIOS Vendor American Megatrends Inc.
BIOS MSG 63-0100-000001-00101111-051315-Chipset
BIOS Date 05/13/15
Mainboard Vendor 000001
Memory: DIMM #1/#3/#4 SAMSUNG, DIMM #2 它牌 (最初為 Samsung + Apacer(?) , 後來新增2條Samsung)Chipset
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Northbridge Intel Skylake rev. 07
Southbridge Intel C236 rev. 31
Bus Specification PCI-Express 3.0 (8.0 GT/s)
Graphic Interface PCI-Express 4.0
PCI-E Link Width x8 (max 16x)
PCI-E Link Speed 2.5 GT/s (max 16.0 GT/s)
Memory Type DDR4
Memory Size 64 GBytes
Channels Dual
Memory Frequency 1064.6 MHz (3:32)
CAS# latency (CL) 15.0
RAS# to CAS# delay (tRCD) 15
RAS# Precharge (tRP) 15
Cycle Time (tRAS) 35
Row Refresh Cycle Time (tRFC) 374
Command Rate (CR) 2T
Uncore Frequency 2792.5 MHz
Host Bridge 0x1918
限制:需使用 ECC UDIMM (un-buffer, 不可用 buffer版本-系統不支援此版)
目前: 單條 ECC UDIMM DDR4-2666 16GB
Memory SPD
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DIMM # 1
SMBus address 0x50
Memory type DDR4
Module format UDIMM
Module Manufacturer(ID) Samsung (CE000000000000000000000000000000)
SDRAM Manufacturer (ID) Samsung (CE000000000000000000000000000000)
Size 16384 MBytes
Max bandwidth DDR4-2666 (1333 MHz)
Part number M391A2K43BB1-CTD
Serial number 179EBF25
Manufacturing date Week 43/Year 20
Nominal Voltage 1.20 Volts
EPP no
XMP no
AMP no
EXPO no